Device Packaging Laboratory

RCA Core Research Services provides access to an extensive set of state-of-the-art tools and labs located in the NDSU Research and Technology Park. The tools are available for use by NDSU faculty, staff, and students to support their research activity and for laboratory sessions as part of academic lab courses. The capabilities are also available to external academic and industry users.

Wire and Die Bonders

T41     High Force Die Bonder

T56     Tresky Semi-Automated Die Bonder

T44     K&S 8028 Wire Bonder

T55     Westbond Manual Wire Bonder

Printing / Dispensing Equipment

T45      Milara Screen Printer

T34      Camelot Dispenser

T49      DEK Stencil Printer

Packaging and Assembly Equipment

T36     ADT Wafer Dicing Saw

T48     MyData Pick & Place

T47     Electrovert Reflow Oven

T35     Hanmi Mold Press

T33     Optec Laminator

T29     LPKF Circuit Board Milling Machine

Process Support Equipment

T53     TrioTech Autoclave

T46     Austin America Aqueous Cleaner

T31     March Plasma Cleaner

T32     CSP Ovens: ESPEC Convection Oven, ESPEC Vacuum Oven,

Test and Inspection Equipment

T51     Microhardness Tester

T50     Dage Pull/Shear tester

T39     OGP Measuring System (Smartscope)

T38     Checksum Circuit Tester


Keywords:
Device Packaging Laboratory 
Doc ID:
151724
Owned by:
Fred H. in NDSU Research and Creative Activity
Created:
2025-06-13
Updated:
2026-03-18
Sites:
NDSU Research and Creative Activity