Device Packaging Laboratory
RCA Core Research Services provides access to an extensive set of state-of-the-art tools and labs located in the NDSU Research and Technology Park. The tools are available for use by NDSU faculty, staff, and students to support their research activity and for laboratory sessions as part of academic lab courses. The capabilities are also available to external academic and industry users.
Wire and Die Bonders
| T41 | High Force Die Bonder | ||
| T56 | Tresky Semi-Automated Die Bonder | ||
| T44 | K&S 8028 Wire Bonder | ||
| T55 | Westbond Manual Wire Bonder |
Printing / Dispensing Equipment
| T45 | Milara Screen Printer | ||
| T34 | Camelot Dispenser | ||
| T49 | DEK Stencil Printer |
Packaging and Assembly Equipment
| T36 | ADT Wafer Dicing Saw | ||
| T48 | MyData Pick & Place | ||
| T47 | Electrovert Reflow Oven | ||
| T35 | Hanmi Mold Press | ||
| T33 | Optec Laminator | ||
| T29 | LPKF Circuit Board Milling Machine |
Process Support Equipment
| T53 | TrioTech Autoclave | ||
| T46 | Austin America Aqueous Cleaner | ||
| T31 | March Plasma Cleaner | ||
| T32 | CSP Ovens: ESPEC Convection Oven, ESPEC Vacuum Oven, |
Test and Inspection Equipment
| T51 | Microhardness Tester | ||
| T50 | Dage Pull/Shear tester | ||
| T39 | OGP Measuring System (Smartscope) | ||
| T38 | Checksum Circuit Tester |